Manufacturing Services

HCR-Electronics provides a wide spectrum of electronics manufacturing services supporting the production of circuit board assemblies. Our high standards for quality, support and flexibility, not only exceed industry benchmarks, but our low overhead allows us to provide a competitive advantage.

HCR-Electronics has a highly specialized and dedicated workforce with technical expertise that is closely integrated with the production environment. We can adapt quickly to your requirements with a reliable manufacturing process that includes online work instructions, defect tracking, and shop-floor WIP tracking. Our ISO 9001-certified quality-control process includes supplier qualifications, inspections, failure analysis and prevention action plans.

High Speed Surface Mount (SMT) Board Assembly HCR-Electronics’s high-speed SMT (Surface MounT) manufacturing capabilities include 3 state-of-the-art Fuji assembly lines — each capable of mounting up to 56,000 components per hour.

Mixed Technology, SMT and Through-Hole Board Assembly We offer single and double-sided surface mount, through-hole and mixed technology board assembly — from single prototypes to high-volume production.

Integrated Component Placement Our fully-integrated process for placing components allows lead spacing down to .038mm (.0015”) and package sizes up to 54mm (2.12”). We use the latest equipment for BGA (Ball Grid Array) and CSP (Chip Scale Package) device placement and verify all components to meet or exceed your specifications.

RoHS Compatible Production HCR-Electronics has been certified RoHS compliant to provide lead-free components, bare PCB and solder. We test all RoHS-specified prototypes for burn-in inspection and approval before running full production. Other Value Added Services Provided by HCR-Electronics:

Circuit Design & Layout
Manufacturability Assessment
Material Procurement
Prototype Assembly
Quick-Turn Prototyping / Assembly
Turnkey Production Assembly
Test
Low Volume / High Mix Assembly
Cable Assembly
Offshore Assembly
Distribution